Western Digital develops new storage tech for AI, connected cars

Western Digital Corp. has announced that it has successfully developed its fifth-generation 3D NAND flash memory technology, BiCS5. The technology BiCS5 is built on triple-level-cell (TLC) and quad-level-cell (QLC) technologies, and as per the company, makes it ideal to address the exponential growth of data associated with connected cars, mobile devices and artificial intelligence.
The company has commenced initial production of BiCS5 TLC in a 512-gigabit (Gb) chip and is currently shipping consumer products built on the new technology. Production of BiCS5 in meaningful commercial volumes is expected in the second half of calendar 2020. BiCS5 TLC and BiCS5 QLC will be available in a range of capacities, including 1.33 terabit (Tb).
BiCS5 technology was developed jointly with technology and manufacturing partner Kioxia Corporation. It will be manufactured at the joint venture fabrication facilities in Yokkaichi in Mie Prefecture, Japan and Kitakami City, Iwate Prefecture, Japan.