US NSF signs $50 mn pact with Ericsson, IBM, Intel, Samsung for chip design

San Francisco: The US National Science Foundation (NSF) has announced that it has signed a $50 million pact with Ericsson, IBM, Intel and Samsung to support the design of the next-generation semiconductors.

This partnership is a part of NSF’s ‘Future of Semiconductors’ (FuSe) initiative, NSF said in a blogpost.