State in talks with TSMC on advanced packaging: Arizona governor

The US state of Arizona is in talks with Taiwanese chipmaker TSMC on advanced packaging, state governor Katie Hobbs said on Tuesday, which is crucial for the manufacturing of artificial intelligence (AI) chips.

TSMC, which is building a $40 billion chip factory in Arizona, has not announced plans to build facilities for advanced chip packaging in the United States. Advanced packaging processes stitch multiple chips together into a single device, lowering the added cost of more powerful computing.