Samsung unveils new multi-chip package for 5G smartphones

Seoul: Samsung Electronics released a new multi-chip package (MCP) memory product for use in 5G smartphones as the South Korean tech giant tries to better target the fast-growing handset market.

The world’s largest memory chip producer said it has begun mass-producing low-power double data rate 5 (LPDDR5) universal flash storage (UFS) MCP that integrates high-performance DRAM and NAND flash memory chips in a single compact package.

The latest MCP comes with Samsung’s LPDDR5 mobile DRAM that boasts 25 gigabytes (GB) per second read/write speed, which is 1.5 times faster than that of the previous LPDDR4X, while the performance of UFS 3.1 interface-based NAND flash has been doubled to 3GB/s compared to the previous UFS 2.2 solution.