Samsung launches new chips for its 5G RAN products, says working on 6G technology

NEW DELHI: South Korea’s Samsung Electronics has launched a new range of 3GPP Release 16 compliant chipsets, including a third-generation mmWave Radio Frequency Integrated Circuit (RFIC) chip, a second generation 5G modem System-on-Chip (SoC), and a Digital Front End (DFE)-RFIC integrated chip.

These chips will power Samsung’s next-generation 5G Radio Access Network (RAN) products, including the 5G Compact Macro, Massive MIMO radios, and baseband units, which will all be commercially available in 2022, as per an official statement.

As for further details, Samsung’s 3rd-generation RFIC chip supports both 28GHz and 39GHz spectrums and will be embedded in Samsung’s 5G Compact Macro. Its output power and coverage has also increased, doubling output power of the 5G Compact Macro.