Samsung develops chip packaging tech for high-performance applications

Samsung Electronics said on Thursday that it has developed an advanced chip packaging technology for high-performance applications as the South Korean tech giant eyes to expand its leadership in semiconductor solutions.

The world’s largest memory chip maker said its next-generation 2.5D packaging technology, Interposer-Cube4 (I-Cube4), is expected to be widely used in areas like high-performance computing, artificial intelligence (AI), 5G, cloud and largest data center applicants as it creates enhanced communication and power efficiency between logic and memory chips.

I-Cube is Samsung’s brand for its heterogeneous integration technology that horizontally places one or more logic dies, such as central processing units (CPU) and graphics processing units (GPU),