Rs 25K cr semiconductor packaging plant in Assam soon: Rajeev Chandrasekhar

Union Minister of State for Electronics and Information Technology Rajeev Chandrasekhar on Thursday announced an upcoming semiconductor packaging facility in Assam with an outlay of Rs 25,000 crore, and said that the proposal from Tatas was under consideration.

“I want to share with you today that Assam is soon going to have a Rs 25,000 crore semiconductor packaging plant come up in the state. It is a proposal from the Tatas that has to be evaluated,” he added. Chandrasekhar was talking at the Digital India Future Skills summit in Guwahati.