Right set of policies, incentives to allow India to be a part of global semiconductor industry: Lam Research

NEW DELHI: Lam Research said that “right set of policies” and incentives will allow India to become a part of the global semiconductor industry through wafer-level packaging (WLP) initially, including die-level packaging. It said that India can learn from countries like Israel to chart out its own strategy to develop an ecosystem for the semiconductor industry.

“For India to participate in manufacturing, packaging is the first step. If India’s policies are on the right side, it can enable that. Policies need to be there to provide right support. India can do die level packaging to bring value add and to create jobs,” Rangesh Raghavan, Vice President and General Manager of Lam Research India told ET.