New chip sop structure may deliver quick wins: experts

India’s new incentive structure for semiconductor manufacturing offering a flat 50% incentive sweetens the deal for applicants aiming for older technology nodes as well as for downstream players in the supply chain like those in packaging and assembly and takes the country closer to its ambition of seeding a vibrant chipmaking ecosystem, people aware of the rationale behind the change told ET.

On Wednesday the Centre announced a fresh structure of incentives under its Rs 76,000-crore semiconductor manufacturing scheme offering to bear half the project cost across proposals from semiconductor factories, display panel plants, compound semiconductor proposals, and even assembly and packaging units.