Intel unveils new 2025 roadmap to reclaim global chip market

Chip maker Intel has detailed an ambitious architecture roadmap, showcasing a series of foundational innovations that will power products through 2025 and beyond, with the goal of leading the processor space once again.

The company on Monday showcased two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery.

“Building on Intel’s unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025,” Intel CEO Pat Gelsinger said during the global “Intel Accelerated” webcast.