Intel Lakefield chips to power foldable, dual screen PCs of the future

San Francisco: Chip giant Intel on Wednesday launched new Hybrid Processors codenamed Lakefield for next-gen PCs that would power foldable and dual screen devices of the future.

The Intel Core i5 and i3 Lakefield processors with Intel Hybrid Technology are meant to more intense workloads and foreground applications, while balancing power and performance optimization for background tasks.

The Lakefield chips are fully compatible with 32- and 64-bit Windows applications, the company said in a statement.