Focus on semiconductor packaging right approach for India, says Applied Materials’ Prabu Raja

Semiconductor packaging is poised to be an inflection point in India’s chip-making and fabrication push and the country has the right talent to become a manufacturing centre, Prabu Raja, president of semiconductor products group (SPG) at Applied Materials, told ET in an interview.

The central government’s approach to starting with packaging and testing for semiconductors to build a complete ecosystem for chips is the right approach, Raja said on the sidelines of the Semicon 2023 conference in Gandhinagar, Gujarat.