Apple may use TSMC’s 3nm process for its M2 Pro and M2 Max chipsets, claims report

Apple may reportedly become the first company to use TSMC’s 3nm manufacturing process for its M2 Pro and M2 Max chipsets. According to a report by Commercial Times, both M2 Pro and M2 Max chipsets may be used in this year’s MacBook lineup,
As per the report, the Cupertino-based tech giant will likely first use the 3nm wafers in the second half of 2022 for its M2 Pro chipsets. Then the tech behemoth could also explore using the process to build A17 chipset for 2023 iPhones and in the third-generation of M series. The 3nm process is believed to enhance the performance and the power efficiency of the chipset.
As per earlier reports, Apple could use the M2 Pro and perhaps even the M2 Max chipset in its 14-inch MacBook Pro, 16-inch MacBook Pro, and Mac mini models later this year or in early 2023. From what has been claimed in the reports till now, it looks highly likely that Apple will use the 3nm wafers for the M2 Pro chipsets at least.