Amkor to build $2 billion Arizona semiconductor packaging plant

Amkor Technology said Thursday it will spend $2 billion to build a new advanced semiconductor packaging and test facility in Arizona that will package and test chips for Apple produced at a nearby Taiwanese chipmaker TSMC facility.

Amkor said it will provide advanced packaging and testing of semiconductors to support high-performance computing, automotive, and communications and when the new facility opens, Apple will be its first and largest customer.