How government is planning to boost chip making in India

With an aim to further boost its Make in India initiative, the central government will approve multiple semiconductor packaging and fabrication plant proposals in the coming weeks, IT minister Rajeev Chandrasekhar has said.

The Centre reopened the window for fresh fab applications for leading and mature nodes under the modified semiconductor scheme on June 1.

“@GoI_MeitY has reopened the window for fresh fab applications for leading and mature nodes. This is being done since the January 2022 window was closed before the policy was improved to encourage mature nodes with equal incentives,” the Minister said in a tweet.