Intel announces new 3D Lakefield chips for foldable and ultra-thin laptops

Intel today unveiled its new processors meant for ultra-thin and hybrid laptops. The company has been working on these for a long time now, under the codename Lakefield. The chips use the company’s Foveros 3D packaging technology to combine different chip architectures and memory into one processor.

This allows Intel to stack different components of the processor in three layers. It makes the Lakefield class of processors smaller and they will take up less space than a traditional PC chip. It’s important for ultra-thin and hybrid laptops like the Microsoft Surface Neo, which lack the space inside for traditional PC chips.

The company said these new chips will require 56% smaller package area and 47% smaller board sizes. They will also provide better battery life.